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Micron Technology
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Updated Nov 5, 2026
Micron board director Linnie Haynesworth to retire at January 2027 annual meeting
Linnie Haynesworth, who joined Micron's board in February 2021 and chaired the Security Committee from 2024 to 2026, notified the board on November 2, 2026 that she will retire and not seek reelection at the January 14, 2027 annual shareholders meeting. Her departure will reduce the board from nine to eight directors. The remaining eight directors—Alexis Black Björlin, Lynn A. Dugle, Steven J. Gomo, T. Mark Liu, Sanjay Mehrotra, A. Christine Simons, Robert H. Swan, and MaryAnn Wright—have been nominated for reelection.
Tone: neutralRevenue
$133.2B
MU 10-K · FY 2026
Employees
61,000
Revenue growth YoY
+49%
Headquarters
Boise, ID
Profile
MU 10-K Item 1 · Oct 9, 2026Micron Technology is a global semiconductor memory and storage manufacturer producing DRAM, NAND, and NOR products sold across data center, mobile, client, automotive, and industrial markets. The company operates wholly-owned fabrication facilities in Taiwan, Singapore, Japan, the United States, Malaysia, China, and India. Its product portfolio spans components, modules, SSDs, managed NAND, multi-chip packages, and advanced solutions including HBM for AI applications.
Read filing description ↓ Collapse description ↑
We are a global leader in semiconductor memory and storage, powering AI and compute-intensive applications from cloud to edge. With a relentless focus on our customers, technology and product leadership, and manufacturing and operational excellence, our comprehensive portfolio of high-performance DRAM, NAND, and NOR solutions deliver the speed, efficiency, and scale today's workloads demand, accelerating intelligence to enrich life for all. We manufacture our products at wholly-owned facilities and also utilize subcontractors for certain manufacturing processes. Our global network of manufacturing centers of excellence not only allows us to benefit from scale while streamlining processes and operations, but it also brings together some of the world's brightest talent to work on the most advanced memory technology. We continue to make significant investments to develop proprietary product and process technology, which generally increases bit density per wafer and reduces per-bit manufacturing costs of each generation of product. We continue to introduce new generations of products that offer improved performance characteristics, including higher data transfer rates, higher bandwidth, advanced packaging solutions, lower power consumption, improved read/write reliability, and increased memory density. We face intense competition in the semiconductor memory and storage markets. To remain competitive, we must continuously develop and implement new products and technologies and decrease manufacturing costs in spite of inflationary pressures, changing technologies, rapid market changes, and regulatory uncertainty. Our success is largely dependent on obtaining returns on our R&D investments, efficient utilization of our manufacturing infrastructure, development and integration of advanced product and process technologies, market acceptance of our diversified portfolio of semiconductor-based memory and storage solutions, and efficient capital spending.
Primary products
- DRAM
- High-Bandwidth Memory (HBM)
- Double Data Rate (DDR)
- Low-Power DRAM (LPDDR)
- Graphics DRAM (GDDR)
- NAND
Business segments
End markets
Geographies
Named competitors
“We face intense competition in the semiconductor memory and storage markets from a number of companies, including Samsung Electronics Co., Ltd.; SK hynix Inc.; Kioxia Holdings Corporation; Sandisk Corporation; ChangXin Memory Technologies, Inc. ('CXMT'); and Yangtze Memory Technologies Co., Ltd. ('YMTC').” Competitive position, as stated in the filing
Revenue commentary · FY 2026
Total revenue for 2026 increased 256% as compared to 2025, primarily due to increases in average selling prices and bit shipments for both DRAM and NAND products.
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